Ultrafuse® PC GF30 Details

filaments

Ultrafuse® PC GF30

Ultrafuse® PC GF30 is a unique compound of PC with 30% glass fibers, specially designed for FFF printing. With its high heat deflection temperature and good dimensional stability, Ultrafuse® PC GF30 is the right material to use in an industrial environment where good temperature resistance and high strength is needed.

Its UL94 V0 rating makes PC GF30 the perfect solution for applications in transportation industry that require flame retardancy. The resistance to UV light exposure and its low moisture uptake makes Ultrafuse® PC GF30 highly suitable for interior and exterior applications.

Category: filaments
an-img-01
icon01
Benefits at a Glance
  • Flame retardancy V0 according to UL 94 (@1.5mm and 3.0mm)
  • Resistance to UV light exposure
  • Good temperature resistance
  • High stiffness and strength
  • Good heat deflection temperature
  • High dimensional stability
  • Very low moisture absorption
  • Railway classification according to EN 45545-2
icon01
Example Applications
  • Automotive / transportation
  • Electronics
  • Functional prototyping
icon01
Material Properties
  • Tensile Strength (MPa): 36,1 (XY), 11,2 (ZX)
  • Elongation at Break (%): 2,4 (XY) , 1,1 (ZX)
  • Flexural Modulus (MPa): 2690 (XY) , 3450 (XZ) , 934 (ZX)
  • Impact Strength Charpy unnotched (kJ/m2): 17,1 (XY) , 18,9 (XZ) , 3,7 (ZX)
  • Impact Strength Izod unnotched (kJ/m2): 13,9 (XY) , 17,8 (XZ) , 3,4 (ZX)
  • HDT @ 0,45 MPa: 134 °C
icon01
Printing Guidelines*
  • Nozzle Temperature: 280-330 °C
  • Build Chamber Temperature: -
  • Bed Temperature: 80 - 100 °C
  • Bed Material: Perforated plate, DimaFix or Magigoo PC glue*
  • Nozzle Diameter: ≥ 0.6 mm
  • Print Speed: 30-60 mm / s